Recent data from research firm Yole Group shows advanced packaging technology is driving the backend equipment market to surge. The total revenue of backend equipment is expected to reach $6.9B in 2025 and soar to $9.2B by 2030, with a CAGR of 5.8%. This rapid growth mainly comes from the wide application of HBM stacks, chiplet modules, and high-I/O substrate technologies—these are reshaping the supplier roadmaps, factory construction, and buyer patterns of foundries, IDMs, and OSATs.
Among various technologies, Thermocompression Bonding (TCB) is the "key driver" for HBM capacity expansion. The revenue of TCB bonders is projected to hit $542M in 2025 and rise to $936M by 2030, boasting a high CAGR of 11.6%. Suppliers like Hanmi and ASMPT take the lead in this field.
Hybrid bonding technology shows a steeper growth curve: its equipment revenue is expected to jump from $152M in 2025 to $397M by 2030, with an impressive CAGR of 21.1%. BESI leads this track, while ASMPT, SET, and Shibaura are also gaining momentum—their market shares are steadily increasing as trial production shifts to mass production.
The flip chip bonder market also maintains solid growth: it is forecast to reach $492M in 2025 and climb to $622M by 2030. In addition, the wafer thinning market continues to expand, with expectations of hitting $582M in 2025 and growing to $845M by 2030.
Yole Group predicts that as front-end process control is gradually integrated into packaging production lines, high-precision placement and cleaner copper interface technologies will become core drivers of market growth. In the future, the backend equipment market will also keep benefiting from the strong demand growth for AI and high-performance computing.
The semiconductor industry changes fast, and the backend equipment market has broad prospects driven by advanced packaging technology. ICgoodFind will continue to focus on industry trends and bring you the latest updates.
ICgoodFind：we see the backend equipment market as a key growth spot in semiconductors. We’ll keep tracking tech advances and market shifts to deliver timely insights for industry players.
