Brand
Bourns J.W. Miller(94)
NXP(26)
ProTek Devices(1)
Carling Technologies(8)
Eaton Bussmann(4)
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Microchip(4)
Raychem(3)
TE Connectivity(3)
Phoenix(48)
Weidmuller(1)
Maxim Integrated(2)
TI(2)
TDK(13)
ST Microelectronics(4)
Epcos(16)
Semitron(1)
Schaffner(1)
Vishay Semiconductor(2)
Lumex(1)
American Power Conversion(1)
Semtech Corporation(3)
Hammond Manufacturing(1)
ON Semiconductor(2)
Mean Well(2)
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Encapsulation
轴向引线(25)
SOD-962(4)
TSSOP(3)
SMD-2(13)
(23)
SOT-96(1)
SOD-323(2)
SOT-23-3(1)
SOT-886(1)
SSOT-6(2)
DFN-6(2)
SOT-23(2)
64 mm x 48 mm(6)
DFN-12(1)
DFN-18(2)
SMD(7)
SOD-523(2)
DIN Rail(17)
3终端通孔(19)
Radial, Disc(6)
Axial Leaded(9)
MODULE(6)
Base(1)
TDFN-6(1)
PDIP(1)
-(3)
QFN-24(1)
HTSSOP-38(1)
DSBGA-12(1)
SMD-3(8)
QFN-2(4)
SMD-6(2)
SOT-666(1)
DO-214AA(3)
Axial Cylinder, 3 Lead (Radial Bend)(5)
DO-214AA-2(5)
SOT-89-3(2)
(44)
SOD-882(1)
Cartridge(1)
DO-219AB(2)
SOT-665(1)
2终端通孔(4)
SMD(14)
SOIC-8(1)
Radial Leaded(2)
SOIC(2)
SOT-23(1)
SIP(3)
SOT-984-1(1)
SOD-523-2(1)
Module, Duty Station(1)
Plug-In(1)
Axial Cylinder(2)
SOT-457(1)
SOD-323-2(1)
SOT-353(1)
HXQFN(1)
SOT-983-1(1)
DFN-2(1)
DFN-4(1)
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Packaging
Bulk(60)
(39)
Each(10)
Bag(7)
Cut Tape (CT)(25)
Tape & Reel (TR)(71)
Tray(35)
Tube(3)
(31)
Box(1)
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