Description:
DIPSocket with gold-plated tulip hook shaped contacts and tin plated pins. The PCB has solder and flux to prevent capillary action. The open frame structure maximizes heat dissipation performance. Temperature range: -65 ° C to+125 ° C. Contact: beryllium copper. Pin: brass. 100 cycles (contact life). Insulation resistance: 5 x 109 Ω (at 500V DC voltage) (standard, high temperature); >104 M Ω (at 500V DC voltage) (FR4 epoxy) # # # IC socket DIP turned pins
Description:
DIPSocket with gold-plated tulip hook shaped contacts and tin plated pins. The PCB has solder and flux to prevent capillary action. The open frame structure maximizes heat dissipation performance. Temperature range: -65 ° C to+125 ° C. Contact: beryllium copper. Pin: brass. 100 cycles (contact life). Insulation resistance: 5 x 109 Ω (at 500V DC voltage) (standard, high temperature); > 104 M Ω (at 500V DC voltage) (FR4 epoxy) # # # IC socket DIP turned pins
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