On September 10, TSMC released its operating data for August. Monthly revenue reached 514.8 billion NTD (approximately $16.3 billion), rising sharply by 53.3% year-on-year and 10.1% quarter-on-quarter, maintaining rapid growth and directly reflecting the explosive global demand for AI chips.
According to management, TSMC is building around 20 factories at home and abroad at the same time, compared with only 4 to 5 factories in the past. The scale of capacity expansion is 4-5 times higher than before. Even so, capacity still cannot keep up with market orders, and demand for chip manufacturing equipment has nearly doubled since the end of last year.
In terms of capital expenditure, TSMC’s 2026 capital spending is expected to reach a record high of $60-64 billion. The firm also plans to introduce High-NA EUV lithography machines by 2030. It raised full-year earnings guidance, judging that strong demand brought by AI infrastructure will continue beyond 2027. Analysts estimate year-on-year revenue growth of 46.8% for this quarter.
Booming orders for AI computing chips drive up wafer foundry capacity, and the pressure on prices and lead times of high-end chips is also passed down to supporting devices such as PMIC and interface chips.
R&D and procurement teams of hardware enterprises need to continuously track original manufacturer capacity updates, make medium and long-term stocking plans, broaden procurement channels and attach importance to alternative component selection. ICGOODFIND provides spot chip inquiry, BOM kitting and alternative material reference services to help enterprises tackle supply chain challenges caused by capacity shortage.
TSMC, AI chips, wafer foundry, EUV lithography, chip capacity, component procurement, BOM kitting, ICGOODFIND
Disclaimer: This article is compiled from public industry information for reference only, and does not constitute procurement or investment advice.
