MediaTek unveiled three new IoT SoC platforms at Embedded World 2026 in Nuremberg on March 9th. The lineup includes the high-end Genio Pro, and the mid-range and entry-level Genio 420 and Genio 360, covering a broad spectrum of IoT device requirements.
The flagship Genio Pro is built on TSMC's 3nm process with CPU/GPU specs rivaling the Dimensity 9400. It supports industrial temperature ranges, up to 16 cameras, and 3x 4K displays. Targeting autonomous mobile robots and commercial drones, it supports Linux and ROS, sampling Q1 2026.
The mid-range Genio 420 (6nm) delivers 7.2 TOPS AI, integrates 16GB LPDDR5X, and supports dual 2.5K60 or single 4K60 displays. It's pin-compatible with Genio 720/520 for easy migration.
The entry-level Genio 360 series (6 TOPS / 8.5 TOPS AI) supports 8GB LPDDR4X and runs 2-billion-parameter models on-device. Sampling now.
ICgoodFind : MediaTek's new Genio trio spans 3nm high-end to cost-effective entry points, accelerating intelligent IoT development.
