JCET Group quietly launched its new chip packaging and testing facility in Shanghai's Lingang special area yesterday. The JCEC Automotive (Shanghai) Co., Ltd. (JSAC) plant is purpose-built for automotive electronics and robotics applications, marking a strategic push into advanced packaging for physical AI chips.
The company notes that smart cars and intelligent robots share the same fundamental logic—both are "physical world intelligent agents." Their chips demand similar processing power, integration levels, and application capabilities. JSAC leverages JCET's strong automotive-grade packaging expertise while building out technical capabilities that seamlessly support robot control and sensor chips, creating a dual-market synergy.
The facility focuses on high-reliability production for autonomous driving, body and chassis control, and power management, while accommodating physical AI chip needs. It features Industry 4.0 automation, full traceability, and AI-assisted defect detection to boost yield and efficiency.
ICgoodFind : JCET's new Shanghai facility bridges auto and robot chip packaging, positioning for the physical AI era.
