Shanghai Jiata Semiconductor, a prominent Chinese semiconductor manufacturer specializing in specialty processes, has completed a significant capital raise. Its registered capital has increased from approximately 16.9 billion yuan to 17.9 billion yuan, following investments from a consortium of state-backed and private funds, including Xiamen C&D Investment, China Electronics Corporation (CEC), and CICC Capital.
The company is a key player in China's silicon carbide sector. This latest funding continues its strong financial momentum, having raised 8 billion yuan in 2021 and a record 13.5 billion yuan in 2023. Jiata has set ambitious capacity targets, aiming to increase its total monthly output (in 8-inch wafer equivalents) from 300,000 wafers to 350,000 wafers by 2026. A core growth area is its SiC production line, which already exceeds a monthly capacity of 10,000 wafers, making it one of the few domestic firms with scale manufacturing capabilities in this field. It notably serves as the sole foundry partner in Mainland China for Infineon.
Jiata is advancing its technology, co-developing next-generation trench-type SiC MOS devices and building a proprietary automotive-grade SiC process platform. Strategically, it is extending its reach down the value chain, having established a wholly-owned subsidiary, Shanghai Jiata Chuangneng Semiconductor, for device sales, and is deepening collaborations within the Lingang automotive and wide-bandgap semiconductor industrial alliance.
ICgoodFind's Insight
Jiata Semiconductor's successful capital raise and clear SiC capacity roadmap underscore the intense focus and investment flowing into this critical segment of China's semiconductor industry. It positions the company as a central player in the domestic supply chain for next-generation power electronics.
