China has taken a significant step to strengthen its semiconductor supply chain by establishing a dedicated National Working Group for IP Cores under its National Technical Committee for Integrated Circuit Standardization. This move aims to address long-standing industry pain points such as inconsistent design practices, poor compatibility, and frequent intellectual property disputes, laying a foundation of standards for domestic chip independence.
The inaugural meeting of the IP Core Working Group was held on December 4, 2025, in Shanghai. Officials from the Ministry of Industry and Information Technology (MIIT) and the China Electronics Standardization Institute (CESI) emphasized the critical role of IP cores—pre-designed, reusable circuit blocks—as the foundation for efficient chip design. The group's primary mission is to accelerate the development of a coherent and supportive standard system, focusing on creating key technical specifications and promoting the international adoption of these standards.
The broader National Technical Committee, overseen by MIIT, covers the entire semiconductor industry chain. The creation of this specialized IP Core Working Group signifies a more professional and in-depth approach to standardizing this crucial niche, which is essential for improving design efficiency and reducing development risks.
ICgoodFind's Insight
The establishment of this standards body is a strategic move to formalize and control a foundational layer of the chip design ecosystem. By setting domestic standards, China aims to reduce fragmentation, foster interoperability, and ultimately accelerate its path toward a more self-reliant semiconductor industry.
