On September 21, NearLink announced it will standardize capability tiers to clearly differentiate the features supported by chips at various levels—similar to version distinctions like Bluetooth 4/4.2/5.0 and Wi-Fi 5/6/7. The initial classification follows the pattern: NearLink【E / B / P】(X / Y).
【E / B / P】represent the main air interface modes:
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E (SLE): Emphasizes ultra-low power consumption while offering high efficiency and high reliability (anti-interference), providing devices with stable and energy-efficient connectivity.
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B (SLB): Delivers high bandwidth, low latency, and high concurrency, making it ideal for scenarios requiring high-speed and efficient data transmission.
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P (SLP): Provides precision positioning capability for accurate location tracking.
(X / Y) indicates the generational version of the chip, differentiating capabilities within the same air interface mode. For example:
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NearLink E1.0: The first-gen low-power chip supporting basic “discoverable” and “connectable” features, ensuring device interoperability with high efficiency and reliability.
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NearLink E2.0: The second-gen low-power chip that supports more complex application requirements.
NearLink is China’s native next-generation short-range wireless connectivity technology, designed specifically for short-distance data transmission. Compared to traditional Bluetooth and Wi-Fi, it significantly improves speed, latency, range, security, and reliability, acting as an enhanced hybrid of “Wi-Fi + Bluetooth.” Developed collaboratively under the guidance of the MIIT, the NearLink Alliance was officially established on September 22, 2020. Version 1.0 was released in November 2022, followed by version 1.1 in April 2023. On August 4, 2023, Richard Yu, CEO of Huawei Consumer BG, announced the integration of NearLink into the HarmonyOS ecosystem.
ICgoodFind : NearLink’s new capability classification system helps industry players better select suitable chips, accelerating the adoption of NearLink across applications and driving technological advancement.
