September 1 – Amkor, the world’s second-largest OSAT (outsourced semiconductor assembly and test) firm, announced on August 28 (local time) adjustments to its advanced packaging facility construction plan in Peoria, Arizona. The facility’s location remains unchanged, but its site area has nearly doubled – from 56 acres to 104 acres – marking a significant scale expansion.
Under the revised plan, the total investment in the packaging and testing facility reaches **$2 billion**, with construction set to start within days. It is scheduled to begin production in early 2028 and will create 2,000 jobs once operational. Compared to the previous plan, the investment has increased from $1.7 billion, and the mass production timeline has been slightly adjusted from late 2027 to early 2028 – optimizing both project input and progress pace.
In terms of cooperative layout, Amkor’s project has strong targeting: On one hand, the new plant will exclusively provide packaging and testing services for advanced process chips produced by TSMC’s Phoenix factory, and is expected to synergize with TSMC’s U.S. advanced packaging plant in the future to strengthen industrial chain linkage. On the other hand, Amkor confirmed in April this year that it will introduce Intel’s EMIB packaging technology into facilities like the one in Peoria, to deeply meet Intel’s technical needs.
The expansion of Amkor’s Arizona project demonstrates its determination to boost its presence in the North American semiconductor packaging and testing market. ICgoodFind will continue to track the project’s progress and deliver key industry updates.
ICgoodFind：Amkor’s $2B U.S. plant expansion signals its focus on North America’s chip packaging sector. We’ll monitor how this project strengthens its ties with TSMC and Intel, and share timely developments.
