Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 20
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TP13057BDW
|
TI | 功能相似 | SOIC-16 |
整体式串行接口联合PCM编解码器和过滤器 MONOLITHIC SERIAL INTERFACE COMBINED PCM CODEC AND FILTER
|
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