Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Obsolete
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CXK58257AP-10L
|
SONY | 功能相似 | DIP |
SRAM Chip Async Single 5V 256Kbit 32K x 8 100ns 28Pin PDIP
|
||
HM62256ALP-10SL
|
HITACHI | 功能相似 | DIP |
32/768-word x 8Bit High Speed CMOS Static RAM
|
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