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Model IS61LPD102418A-250B3
Description SRAM 18Mb,Pipeline,Sync,1Mb x 18,250MHz,3.3V or 2.5V I/O,165 Ball BGA
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Brand: Integrated Silicon Solution
Packaging FBGA-165
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Standard packaging quantity 1
0yuan
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(8824) Minimum order quantity(1)
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Technical parameters/access time: 2.6 ns

Technical parameters/operating temperature (Max): 70 ℃

Technical parameters/operating temperature (Min): 0 ℃

Technical parameters/power supply voltage (Max): 3.465 V

Technical parameters/power supply voltage (Min): 3.135 V

Encapsulation parameters/installation method: Surface Mount

Encapsulation parameters/Encapsulation: FBGA-165

External dimensions/packaging: FBGA-165

Physical parameters/operating temperature: 0℃ ~ 70℃

Compliant with standards/RoHS standards: Non-Compliant

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