Technical parameters/power supply voltage (DC): 1.80 V
Technical parameters/clock frequency: 167MHz (max)
Technical parameters/access time: 167 µs
Technical parameters/memory capacity: 18000000 B
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: LBGA-256
External dimensions/packaging: LBGA-256
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray, Bulk
Compliant with standards/RoHS standards:
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CYD18S72V18-167BBXC
|
Cypress Semiconductor | 完全替代 | LBGA-256 |
IC SRAM 18Mbit 167MHz 256FBGA
|
||
CYD18S72V18-167BGI
|
Cypress Semiconductor | 类似代替 | BGA-484 |
FullFlex SDR同步双端口SRAM商用和工业温度 FullFlex Synchronous SDR Dual Port SRAM Commercial and Industrial temperature
|
||
CYD18S72V18-200BBXI
|
Cypress Semiconductor | 类似代替 | LBGA-256 |
SRAM Chip Sync Dual 1.8V 18M-Bit 256K x 72Bit 9ns/5ns 256Pin FBGA
|
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