Technical parameters/rated voltage (DC): 125 V
Technical parameters/rated voltage (AC): 600 V
Technical parameters/rated current: 500 mA
Technical parameters/dissipated power: 0.2 W
Technical parameters/resistance: 0.32 Ω
Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -55 ℃
Technical parameters/dissipated power (Max): 0.2 W
Technical parameters/rated voltage: 600 V
Technical parameters/rated voltage (DC Max): 125 V
Technical parameters/rated voltage (AC Max): 600 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 2
Encapsulation parameters/Encapsulation: SMD-2
External dimensions/length: 9.65 mm
External dimensions/width: 3.05 mm
External dimensions/height: 3.05 mm
External dimensions/packaging: SMD-2
Physical parameters/operating temperature: -55℃ ~ 125℃
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
B0500T
|
Bourns J.W. Miller | 功能相似 | SMD-2 |
Fuse Chip 0.5A 600V SMD Solder Pad 9.65 X 3.05mm Ceramic T/R
|
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