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Model BUK129-50DL,118
Description Buk129-50dl - Logic level Topfet Smd version Buk118-50dl
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Brand: NXP
Packaging TO-263-3
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Packaging method Tape & Reel (TR)
Standard packaging quantity 1
0yuan
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(3364) Minimum order quantity(1)
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Technical parameters/number of output interfaces: 1

Technical parameters/polarity: N-CH

Technical parameters/drain source voltage (Vds): 50 V

Technical parameters/Continuous drain current (Ids): 16A

Technical parameters/rise time: 30000 ns

Technical parameters/output current (Max): 16 A

Technical parameters/descent time: 35000 ns

Technical parameters/operating temperature (Max): 150 ℃

Technical parameters/operating temperature (Min): -55 ℃

Technical parameters/dissipated power (Max): 65000 mW

Encapsulation parameters/installation method: Surface Mount

Package parameters/number of pins: 3

Encapsulation parameters/Encapsulation: TO-263-3

External dimensions/packaging: TO-263-3

Physical parameters/operating temperature: 150℃ (TJ)

Other/Product Lifecycle: Obsolete

Other/Packaging Methods: Tape & Reel (TR)

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: Lead Free

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
BUK129-50DL BUK129-50DL NXP 功能相似 D2PAK
Logic level TOPFET SMD version of BUK118-50DL
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Logic level TOPFET SMD version of BUK118-50DL
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