Package parameters/number of pins: 84
Encapsulation parameters/Encapsulation: PGA-84
External dimensions/length: 30.6705 mm
External dimensions/width: 30.6705 mm
External dimensions/packaging: PGA-84
External dimensions/thickness: 3.68 mm
Physical parameters/operating temperature: -55℃ ~ 125℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
7025L55G
|
Renesas Electronics | 功能相似 | PGA-84 |
SRAM Chip Async Dual 5V 128Kbit 8K x 16 55ns 84Pin CPGA Tray
|
||
7025L55G
|
Integrated Device Technology | 功能相似 | BPGA-84 |
SRAM Chip Async Dual 5V 128Kbit 8K x 16 55ns 84Pin CPGA Tray
|
||
7025S55G
|
Integrated Device Technology | 功能相似 | BPGA-84 |
Ic Sram 128Kbit 55ns 84pga
|
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