Technical parameters/power supply voltage: 2.4V ~ 2.6V
Package parameters/number of pins: 256
Encapsulation parameters/Encapsulation: LBGA-256
External dimensions/length: 17.0 mm
External dimensions/width: 17.0 mm
External dimensions/packaging: LBGA-256
External dimensions/thickness: 1.40 mm
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tube, Rail
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Integrated Device Technology | 完全替代 | CABGA-256 |
512K x 36 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O's
|
||
70T653MS12BCI
|
Integrated Device Technology | 完全替代 | CABGA-256 |
SRAM Chip Async Dual 2.5V 18M-Bit 512K x 36 12ns 256Pin CABGA Tray
|
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