Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC
External dimensions/length: 152.4 mm
External dimensions/width: 152.4 mm
External dimensions/height: 101.6 mm
External dimensions/packaging: SOIC
Physical parameters/materials: Epoxy Glass
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
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