Encapsulation parameters/Encapsulation: TSSOP
Packaging parameters/pin spacing: 508 µm
External dimensions/length: 102 mm
External dimensions/width: 152.4 mm
External dimensions/height: 101.6 mm
External dimensions/packaging: TSSOP
External dimensions/pin spacing: 508 µm
Physical parameters/materials: Epoxy Glass
Other/Product Lifecycle: Active
Other/Packaging Methods: Bag
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
8100-SMT10-LF
|
Twin Industries | 功能相似 | TSSOP |
TWIN INDUSTRIES 8100-SMT10-LF 原型电路板, SMT 适配器, FR4, 环氧玻璃复合, 152.4mm x 101.6mm
|
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