BCP68,115 In Stock|PDF|Datasheet|Price|Agent[BCP68,115 Alternative|Silk Screen|Technology|Solution Development]-ICGOODFIND

Warm reminder: The pictures are for reference only. The actual product may vary

pk Collection Purchase of mobile phones

Model BCP68,115

Description NXP BCP68,115 单晶体管双极, NPN, 20 V, 170 MHz, 650 mW, 2 A, 85 hFE

Brand: NXP

Packaging TO-261-4

Delivery time

Packaging method Tape & Reel (TR)

Standard packaging quantity 1

Add to Cart Buy now

Welcome to use ICGOODFIND AI Assistant

Chip AI consultant

Download related files

PDF

Technical parameters/frequency:	170 MHz
Technical parameters/number of pins:	4
Technical parameters/polarity:	NPN
Technical parameters/dissipated power:	650 mW
Technical parameters/breakdown voltage (collector emitter):	20 V
Technical parameters/Maximum allowable collector current:	2A
Technical parameters/minimum current amplification factor (hFE):	85 @500mA, 1V
Technical parameters/maximum current amplification factor (hFE):	50 @5mA, 10V
Technical parameters/rated power (Max):	1.4 W
Technical parameters/DC current gain (hFE):	85
Technical parameters/operating temperature (Max):	150 ℃
Technical parameters/operating temperature (Min):	-65 ℃
Technical parameters/dissipated power (Max):	1.4 W
Encapsulation parameters/installation method:	Surface Mount
Package parameters/number of pins:	4
Encapsulation parameters/Encapsulation:	TO-261-4
Dimensions/Length:	6.7 mm
Dimensions/Width:	3.7 mm
Dimensions/Height:	1.7 mm
Dimensions/Packaging:	TO-261-4
Physical parameters/operating temperature:	150℃ (TJ)
Other/Product Lifecycle:	Active
Other/Packaging Methods:	Tape & Reel (TR)
Other/Manufacturing Applications:	Power Management, Industrial, Automotive
Compliant with standards/RoHS standards:	RoHS Compliant
Compliant with standards/lead standards:	Lead Free
Compliant with the REACH SVHC standard:	No SVHC
Compliant with standard/REACH SVHC version:	2015/12/17